Turnkey PCB Assembly

One of the most common testing methods used by manufacturers of PCBs is automated optical inspection or an AOI. This process involves using a camera to inspect a part using a technique that aims to detect potential defects.
This non-contact technique is commonly used to inspect PCBs during various process stages, such as the pre-flow, post-flow, and solder paste applications. It’s beneficial for the manufacturer and the service provider as it helps prevent potential issues when the PCBs become functional.

1) Why is AOI better than Manual inspection?
Despite the increasing complexity of PCBs, they still undergo manual inspection. However, this method is insufficient to ensure that the parts are adequately mounted and not missing. In addition, it can also fail to identify errors such as incorrectly mounted components. An automated microscopic inspection is, therefore, essential.

2) Advantages of AOI
The company can identify surface defects such as scratches, missing or incorrectly mounted components, and solder flaws using an automated inspection tool known as an AOI. Human eyes are capable of seeing these defects at a very minute level. The ability to run through various process phases is the best part of Automated On-Line Inventory (AOI). It can be applied and run through multiple times depending on the requirements.
Inspecting a single board of PCBs is not enough to determine all the flaws in an entire assembly. An inspection of a PCB assembly involves identifying component soldering defects and values.
Compared to other methods, such as X-ray inspection, an automated AOI system is more cost-effective. It can help prevent the repetition of errors and increase the production values of a company. The AOI inspection result is high precision and reliable.

1) What is Flying Probe Testing?
The flying probe technique is one of the most popular forms of in-circuit testing. This method differs from ICT in that it uses movable pitch components to contact the surface-mounted devices (SMDs). It also inspects various components and wires and has a camera for capturing images of the component injection and polarity.
Flying probe testing (FPT) refers to testing that doesn’t require custom fixtures. Its relatively simple programming and pricing structure has gained widespread popularity. It can be used for low-volume production and prototype testing. However, in some instances, it can also be utilized for high-volume production.

2) Advantage of Flying Probe Testing
Due to its various advantages, flying probe testing has become integral to many electronic device manufacturers’ operations. For example, this technique can be utilized to test the performance of their boards. Besides being more accurate, this method offers a cost-effective alternative to traditional methods.
FPT is known for its flexible design. That is because it can be programmed and controlled using software, which makes it ideal for changing components or wiring without going through many steps. Also, unlike other testing methods, it does not require any fixtures.
Instead, the needle moves seamlessly across the board, referred to as fixtureless testing.
The FPT is a simple mechanism to hold a circuit board in place. The needle-like probes can be set to connect with specific nodes. If required, the landing position can be changed.
The testing begins when the probes move over the assembly of the circuit board. The probes are pre-programmable and executed according to the design requirements. If something goes wrong, the output of the device will fail.
The ability to test complex assemblies using the flying probe gives OEMs more clarity. Initially, this type of testing was only used to check empty circuit boards.
This method can be used to check the performance of field-programmable gate arrays or FPGA devices. However, it is very challenging to implement other methods in this type of testing.

In-circuit testing is a type of electronic testing that involves connecting an electronic device to an external power supply. This testing method observes the device’s behaviour while still in its housing.
This technique can identify and prevent defects in electronic devices, such as those found in microchips and printed circuit boards. It can also test other components, such as cold and bad solder joints.
In-circuit testing involves the use of various components. Some of these include bed-of-nails, software, and fixtures. This post discusses some of the most common testers used during the process.

1) Why do we need to use X-Ray Inpsection?
The design of printed circuit boards (PCBs) has evolved over the years. Due to their compact size and dense construction, they are becoming more popular. Some commonly used packages include flip chips, BGAs, and CSPs. These components are invisible to the naked eye and can prevent damage or failure.
Since these components are designed to operate long, they can damage the electronic equipment used. To prevent this, the manufacturers use X-ray inspection techniques. This process involves examining PCBs’ inner and outer packaging using short-wave X-rays.
This article provides an overview of the various aspects of X-Ray inspection for PCBs. It also explains its working procedure and the benefits of this technique for your PCB applications.

2) Advantages of X-Ray inspection
Many manufacturing errors, such as solder voids, broken bridges, and component placement issues, are typically overlooked during visual inspection. X-Ray inspection can help identify these issues and prevent them from happening in the first place.
Although X-Ray inspection equipment can be expensive, it is very cost-effective to ensure that a printed circuit board is defect-free. Early findings of the error prevent the production stop.

1) what is Burn-In Testing?
This testing involves exposing a printed circuit board (PCB) to high temperatures and other conditions. This process helps identify the defects in the board and prevent it from failing. During the process, the assembled PCBs are exposed to varying temperatures for up to 20 hours.
The PCBs can be tested by keeping them inside an oven. These are usually made from materials such as FR4, which can withstand high temperatures and harsh environmental conditions.
If the temperature gets higher than usual, the PCBs made of polyimide are tested to ensure they can withstand the conditions. In addition, the burn-in process is also carried out on the board’s components to ensure the manufacturing process is conducted according to the highest standards.

2) Advantages of Burn-in testing
In addition to being beneficial for mission-critical applications, burn-in testing is also commonly used to test PCBs. There are various advantages to this method.
One of the main advantages of this process is it eliminates the risk of failure due to errors in the printed circuit boards. This type of testing can identify various defects, such as metallization, conductor, and dielectric losses. The best quality PCBs subjected to this type of testing is free of these defects.
We use the above testing to ensure the quality of the turnkey PCB electronics is good and shipped to you.