16+ Years Experience in PCB Manufacturing

  • PBGA, WBCSP, FCBGA and FC-CSP
  • Blind & Buried Vias, Stacked & Staggered Vias, Any-Layer HDI
  • Via Plugging by Conductive & Non-Conductive Material
  • Backdrill, Backplane, Impedance Control with 5% Tolerance
  • ISO9001: 2015 Certified & UL Listed
  • IPC 600 Class 3 & 3A

What is IC Substrate& IC Substrate PCB?

IC substrate is a substrate used to package bare IC (integrated circuit) chips. It is used as an IC carrier to provide signal interconnection between the chip and PCB, heat dissipation channel, and chip protection. IC substrate PCB is a high-end PCB, and its primary function is to serve as a carrier to carry ICs and to connect the signals between the chip and the printed circuit board with lines inside the IC carrier.

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    Classifications of IC Substrate

    • BGA IC substrate
    • CSP IC substrate
    • FC IC substrate
    • MCM IC substrate
    • Rigid IC substrate
    • Flex IC substrate

    The Properties of IC Substrate PCB

    • Lightweight: IC Substrate printed circuit boards are generally very light. It is mainly due to the thin material they use.
    • Extremely reliable: These substrates form a protective layer around the ICs. Therefore, integrated circuit substrate must consist of robust materials.
    • Requiring less alignment and solder joints: IC substrate PCBs are typically smaller than typical PCB substrates. Consequently, they require fewer alignments and solder joints.
    • Compact: IC package substrates are designed to be miniaturized. As a result, they require less material to package.
    • Durable: Despite the large size of some IC package substrate PCBs, they are very robust.

    Applications of IC Substrate PCB

    • Smartphone
    • Laptop
    • Tablet PC
    • Network & Telecommunications
    • Medical
    • Industrial Control
    • Aerospace
    • Military

    The Properties of IC Substrate PCB

    • Lightweight: IC Substrate printed circuit boards are generally very light. It is mainly due to the thin material they use.
    • Extremely reliable: These substrates form a protective layer around the ICs. Therefore, integrated circuit substrate must consist of robust materials.
    • Requiring less alignment and solder joints: IC substrate PCBs are typically smaller than typical PCB substrates. Consequently, they require fewer alignments and solder joints.
    • Compact: IC package substrates are designed to be miniaturized. As a result, they require less material to package.
    • Durable: Despite the large size of some IC package substrate PCBs, they are very robust.

    Why Choose Viasion as Your IC Substrate PCB Supplier

    1
    Sophisticated manufacturing equipment

    Our company's IC Substrate printed circuit board is completed efficiently, resulting from advanced manufacturing facilities.

    2
    Various kinds of integrated circuit substrates PCBs

    As one of the most trusted integrated circuit substrate manufacturers in China, we have a scientific and strict production management and inspection system of quality. So we can supply all kinds of high quality integrated circuit substrate boards.

    2
    Extensive trust & praise

    Our company has gained the trust and praise of many customers with our high-quality products and first-class service and has established a good brand image.

    Benefits of Using IC Substrate printed circuit board

    Viasion summarizes the following benefits of using IC substrate PCBs.

    Integrated Circuit Substrate PCB are lightweight, providing better energy efficiency and performance.

    They offer improved electrical characteristics, including high-speed signal integrity.

    IC Substrate printed circuit boards use thinner copper traces than traditional circuit boards resulting in higher-density designs.

    They provide a more reliable connection due to their reduced size and weight.

    IC Substrate printed circuits enable the design of smaller form factor devices with extra features and functionality.

    They allow faster production times due to shorter wire lengths and fewer solder joints.

    IC Substrate PCB Design Process

    As Viasion’s engineers suggest, the design process of IC substrate PCBs starts with understanding the specific requirements of the IC chip and its integration into the IC package. Then, according to Viasion’s experience, designers must create a detailed layout that includes all components, such as resistors, capacitors, transistors, inductors and any other necessary ICs. What’s more, the IC package substrate PCB must be designed to accommodate the IC package and its specific dimensions so that it will fit perfectly. Lastly, the IC Substrate board must also be designed to ensure proper heat dissipation, given that IC chips generate considerable heat during operation. Once the layout of all components has been completed and their position verified, the integrated Circuit Substrate PCB is sent for fabrication.

    There is no doubt that IC substrate PCB design is essential to ensure the reliable production of IC devices. The success of IC device manufacturing can’t be achieved without successful IC Substrate board designs. Through careful consideration and detailed layout plans, IC device designers can create functional IC substrates that meet IC device requirements.

    Manufacturing Difficulties of IC Substrate PCB

    • Compared with standard PCBs, IC substrate PCBs must overcome the difficulties of manufacturing high-performance and advanced features.
    • IC carrier board is a capital-intensive industry. Its complex production process requires a lot of investment in imported equipment, so producing IC substrate PCB requires a significant capital investment.
    • Compared with standard PCBs, IC Substrate boards must overcome the difficulties of high performance and advanced features in manufacturing.
    • Compared with ordinary PCB products, integrated Circuit Substrate PCB products are smaller in size and higher in precision, with very high requirements in fine lines, hole size and signal interference, thus requiring exact interlayer alignment technology, plating capability, and drilling technology.

    Manufacturing Process of IC Substrate PCB

    • Now, let’s take a glimpse at the manufacturing process of IC Substrate PCB.
    • The manufacturing process of IC Substrate PCBs is intricate and precise and requires a high degree of skill and expertise.
    • The manufacturing process for IC Substrate PCBs involves several steps, including drilling holes into the substrate and laminating layers of fibreglass and epoxy together.
    • After all the layers have been laid down and the holes drilled, a solder mask is applied to protect the integrated Circuit Substrate PCB from exposure to elements in the environment.
    • Finally, Printed circuit boards produced by IC Substrate are tested for electrical or mechanical issues before being sent off for manufacturing applications.

    IC Substrate Testing

    IC substrate testing is a form of electronic testing used to inspect IC (Integrated Circuit) substrates for any defects or damage. IC substrate testing is often done before final assembly or after the IC has been mounted to the board. When ICs are mounted on a board, they are usually tested using automated testing equipment, which helps identify any potential issues with the ICs before installation and final assembly of the IC substrate PCB. IC substrate testing can also detect problems that may arise during operation and check for proper communication between ICs on a board. Without the IC substrate testing, it’s impossible to ensure that all components of an IC are in perfect working order before being put into use.

    The main IC substrate testing methods are as follows.

    1
    Electrical Testing

    This method of IC substrate testing uses automated testing equipment to check for proper communication between ICs on a board and identify any potential issues with the ICs before installation.

    2
    Visual Inspection

    During visual inspection, an operator inspects IC substrates manually under high magnification to look for defects or damage to ensure quality.

    3
    X-Ray Inspection/Scanning

    This IC substrate testing method detects faults in ICs that may be impossible or difficult to observe through manual means.

    4
    Flying Probe Testing (FPT)

    FPT is used during the final assembly of IC substrates and helps identify open circuits, wrong polarities and shorts between pins.

    4
    Automated Optical Inspection (AOI)

    AOI involves scanning each component on a PCBA using unique cameras which capture images at extremely high resolutions. The captured images are then analyzed by computer programs that detect defects, such as missing components, incorrect IC orientation, bad solder joints, etc.

    Conclusion

    As the cornerstone of the IC industry, the IC carrier board is the essential key carrier for the packaging industry. Packaging and testing have become the most competitive segment in China’s semiconductor industry worldwide. The industry generally believes the packaging and testing industry has the highest technological maturity and the earliest breakthrough in the domestic semiconductor industry chain. Along with the maturity of the technology in the field of packaging and testing and the pace of continuous breakthroughs, the domestic IC carrier board market will also rise along with the improvement of packaging and testing technology.
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    Viasion Technology is your trusted partner & one-stop shop for PCB fabrication, components sourcing, PCB assembly and electronic manufacturing. With more than 16 years of experience, we have been supplying high-quality PCBs with competitive pricing for 1000+ customers worldwide. Our company is ISO9001:2015 Certified & UL Listed, and all our products are 100% E-tested and inspected by AOI & X-RAY to meet the highest industry standards. So please get an instant quote from our sales team now, and we will take care of the rest.

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    Frequently Asked Questions

    Single-sided integrated circuit substrate PCB; Double-sided integrated circuit substrate PCB; Multi-Layer integrated circuit substrate PCB; High-Frequency integrated circuit substrate PCB.

    Integrated circuit substrates PCBs provide excellent electrical performance with reduced board space, allowing for the integration of multiple ICs onto a single circuit board. Integrated circuit substrates PCBs also feature improved thermal performance due to their low dielectric constant, leading to better reliability and longer life cycles. Integrated circuit substrates PCBs have excellent electrical properties, including high-frequency characteristics, with minimal signal attenuation and crosstalk levels.

    IC substrates require considerable expertise and skill to fabricate, as they contain several layers of complex wiring, components, and IC packages.
    In addition, IC substrates are often expensive to manufacture due to their complexity.
    Finally, IC substrates are also prone to failure due to their small size and complex wiring.

    IC substrate PCBs differ from standard PCBs in that they are specifically designed to support IC chips and IC-packaged components. As for PCB production aspect, IC Substrate Manufacturing is much difficulty than standard PCB because of it’s high density drill and trace.

    Yes, an IC package substrate PCB can be used for prototyping.

    The biggest challenging is very high density drill such as 0.1 mm blind vias and buried vias, stacked micro via is very common in integrated circuit substrate PCBs manufacturing. And the trace space and width can be as small as 0.025 mm. So it is very critical to find trusted IC substrate factories for such kind of printed circuit boards.