What is acceptance criteria for PCB assembly?
Firstly, the components used in the assembly process must be compatible, which means they must have appropriate mechanical, electrical and thermal properties to work together in the circuit board.
Secondly, the components must be placed accurately on the board with the correct orientation. During placement, all pins should be soldered to the pads to ensure a good electrical connection and no shorts occur.
Thirdly, solder joints should have appropriate shapes and sizes to ensure reliable connections with minimal risk of failure over time.
Lastly, the overall board should be inspected to ensure that there are no defects and that it meets design requirements.
By abiding by these acceptance criteria, PCB assembly processes can ensure the highest levels of quality for the finished product. All of these criteria must be met for a successful PCB assembly.
All in all, PCB assembly processes need to meet the outlined acceptance criteria. And the most commonly used acceptance criteria for PCB assembly is IPC-A-610 standards for PCB and electronics assembly.
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What is IPC-A-610 standard
IPC-A-610, also known as the Acceptability of Electronic Assemblies, is the a widely recognized standard developed by the IPC (Association Connecting Electronics Industries). It is widely accepted as a complete reference for PCB assembly quality and an essential industry benchmark. It helps make sure that electronic assemblies satisfy the highest quality standards, offering customers confidence in their products’ performance.
IPC-A-610 generalizes the criteria for accepting or rejecting electronic assemblies and makes clear acceptable quality standards for electronic products. IPC-A-610 categorizes the acceptability criteria of IPC products into three major classes: Class 1, Class 2, and Class 3.
In Viasion, we only produce as IPC-A-610 Class 2 and Class 3.
What acceptance criteria for PCB assembly do we following in Viasion?
Here in Viasion, we following IPC-A-610 Class 2 or 3 standards to inspect all our PCB assmbly, to make sure our PCB assembly are produced as the highest industry standards. Besides, we will also inspect and delivery our products which meet customer’s special requirements, such as very strict visual standards, special package standards etc.
What are the main difference between IPC-A-610 class 2 and class 3
|Aspects||IPC-A-610 Class 2||IPC-A-610 Class 3|
Dedicated service electronics products, such as consumer electronics, laptops, communications, controls, lighting
higher reliability products such as automotive, medical, militarily, avionics, life support system
Lower standard solder joint acceptance, material finish, terminals, connections, mechanical integrity
High standard solder joint acceptance, material finish, terminals, connections, mechanical integrity
Keeping in mind the differences between IPC-A-610 Classes 2 and 3 is essential for successfully implementing IPC standards. Choosing between IPC-A-610 Classes 2 and 3 needs to take into account the type of application and desired levels of reliability, appearance, performance, etc.
Detailed illustration of our visual acceptance criteria for PCB assembly
Less tin, more tin at solder end
The side stand, turn over, and the warped end of components
The offset in castle-shaped components, the width and height of solderable end)
Flat, L-shaped and wing-shaped pins, lateral offset, the offset of the pin's toe
Flat, L-shaped and wing-shaped pins, the minimum length and height of side solder joints
Flat, L-shaped and wing-shaped pins, the minimum height of the solder joint on the heel, pin coplanarity
Array arrangement of surface-mount surfaces, soldering
Soldering abnormalities：pinhole/blowhole, cold soldering, non-wetting
Soldering abnormalities: Solder balls / spatter, continuous tin, reticulated solder tin
Solder balls do not violate the minimum electrical gap.
Solder balls shall be fixed within the no-removal residue or covered under a conformal coating layer, adhering (soldering) to the metal surface.
Solder tin connects wires that should not be connected.
Solder tin forms a bridge between different wires or components that are adjacent to each other.
The picture below showing the defect: There is spatter of solder balls.
Soldering abnormalities: Broken solder, disordered solder tin, burrs in solder tin
Damages to components
There is no damage to the surface. There are no scratches, cracks, chips, or broken lines on the component body. Identity markings are clearly identifiable.
The picture below showing the defect: The missing of metal plating at the top of the end is more than 50% (each end).
The picture below showing the defect: The missing of metal plating at the top of the end is more than 50% .
The picture below showing the process warning: There is a depression or notch in the plastic component body that does not extend to the seal of the pin or expose the inner functional essence.
Cracks or other deformations affect the mechanical integrity or function of the enclosure.
The distance between the bend of the contact pin and the center is greater than 25% of the thickness/diameter of the contact pin.
Scorching or other damage affect the shape or other functions of the disk loading.
Chips or cracks expose the substrates of the component or functional materials or affect hermeticity, integrity, form, assembly, or function.
The dents and scratches of the component body affect the form, assembly and function or exceed the manufacturer’s specifications.
Damage area with signs of amplification, such as cracks, sharp angles, heat fragile materials, etc.
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