•  PCB rigido
•  PCB flessibile
•  la combinazione di PCB      flessibile e rigido
•  PCB rapido
•  Qualità

Rigid-Flex technology integrates flexible circuit - into rigid board technology. Especially in combination with the well established micro via sequential build up technology, form factor can be reduced while offering high routing density. This optimizes the number of flexible layers, which reduces flex material content compared to standard multilayer flex technology, while, at the same time, design rules and final circuit board properties, especially reliability, are comparable to micro via technology.

Production Capabilities
Layer counts 2-8 layers
Base material Kapton, PI, PET (Flex)/FR4 (Rigid)
Base material thickness 12.5um-50um（Flex）/0.1mm to 3.2mm(Rigid)
Copper thickness 1/2 oz to 1 oz
Protective film thickness 12um to 25um
Adhesive thickness 12um to 35um
Reinforcement PI, PET, FR4, Stainless steel
Maximum board size 9.842''*19.685''
Minimum Line/ Space .002''
Minimum hold .006''

Flowcharts for Rigid-Flex PCB